Aluminum Nitride (ALN)

Aluminum nitride material: no melting point, 2450°C direct sublimation, high temperature strength, high temperature hardness, no softening and deformation even at decomposition temperature.

Coefficient of thermal expansion: 4.5X10-6/K, smaller than aluminum oxide; good thermal shock resistant material.

Resistant to erosion by molten metal: can be used as a high temperature matting and crucible material.

Good thermal conductivity: 170-230 W/m.K, similar to pure aluminum (237 W/m.K) and 5-6 times that of alumina; close to the coefficient of expansion of silicon (3.5-4), making it a good semiconductor encapsulation material.

Good insulating properties: it can be used as an insulating component in high temperature nitrogen furnaces, with low dielectric loss at high frequencies, suitable for high frequency and microwave applications.

We can produce our own aluminum nitride ceramic powder, mainly aluminum nitride raw powder (for making cast substrates), granulation powder (for producing aluminum nitride ceramics by dry pressing process), filler powder (for producing thermally conductive aluminum nitride ceramics); in addition, we can also produce customized aluminum nitride ceramics according to customer requirements, of which we can achieve the maximum processing size of aluminum nitride ceramics is 450mm, the thickest size is 20mm.